Wafer

Wafer
Material used:Quartz、LiNbO3 、LiTaO3
Wafer type: Mirror finished polished product on front and back surfaces
※ (Front: mirror finish polish; Back: #320-1200 finish)


Quality
Item | Accuracy | |
・Quartz crystal ・Q value ・inclusions ・Etch Channel |
・1.8M or more ・Grade Ⅱ or more ・Grade 1 or more |
|
External dimension D | ±0.2mm or less | |
Thickness | 0.08mm or more | |
Orientation flat | Option | |
Main surface finish Rq | 0.5nm or less | |
Plane orientation | ±5'or less | |
TTV | 1μm or less | |
Warp | 50μm or less | |
External diameter | φ50mm (2”) Φ76.2mm (3”) 、Φ100mm (4”) |
Wafer polishing




Wafer measurement


Wafer measurement image (double-sided mirror polish)



