Wafer
Wafer
Material used:Quartz、LiNbO3 、LiTaO3
Wafer type: Mirror finished polished product on front and back surfaces
※ (Front: mirror finish polish; Back: #320-1200 finish)
Quality
| Item | Accuracy | |
| ・Quartz crystal ・Q value ・inclusions ・Etch Channel |
・1.8M or more ・Grade Ⅱ or more ・Grade 1 or more |
|
| External dimension D | ±0.2mm or less | |
| Thickness | 0.08mm or more | |
| Orientation flat | Option | |
| Main surface finish Rq | 0.5nm or less | |
| Plane orientation | ±5'or less | |
| TTV | 1μm or less | |
| Warp | 50μm or less | |
| External diameter | φ50mm (2”) Φ76.2mm (3”) 、Φ100mm (4”) | |
Wafer polishing
Wafer measurement
Wafer measurement image (double-sided mirror polish)
